3Leaf Systems to Demo Silicon Enabled Server Virtualization Technology at Supercomputing 08
3Leaf Systems (www.3leafsystems.com), a provider of next-generation virtualization solutions for enterprise data centers, today announced that the company will showcase new silicon enabled virtualization technology enabling dynamic resource utilization using commodity servers from Super Micro Computer Inc. 3Leaf will demo the solution at Supermicro’s Booth# 1033 at SC08 being held in the Austin Convention Center, Austin, Texas from November 15-21.
Virtualization within high performance computing (HPC) environments presents particular challenges to today’s enterprises. HPC environments require ultra high speed message passing between applications in order to operate in high computing environments, and many of today’s virtualization solutions fall short in providing this capability. In addition, CPU and memory demands from HPC applications continue to drive over-provisioning of servers within the data center.
Now, rather than having to overbuild their infrastructures to allow for high compute or memory intensive jobs, and/or sacrificing performance to achieve virtualization, enterprises have another choice. 3Leaf’s silicon enabled technology demonstrates how enterprises can pool CPU and memory resources across multiple x86 servers to create a cloud environment, enable up to one terabyte of DRAM for memory intensive applications, and achieve low-latency messaging between applications.
“Virtualization, along with compute and memory constraints within today’s scale-out servers, provides many challenges for HPC environments,” said B.V. Jagadeesh, CEO and president, 3Leaf Systems. “With this technology, working together with companies like Supermicro, 3Leaf helps enable virtualization for HPC environments while lowering the capital and operational costs of their HPC infrastructures. Supermicro shares our vision and we are pleased the company is an early adopter of this revolutionary technology.”
“We recognize the strong, unique value that the 3Leaf technology achieves, and are excited to partner with 3Leaf to help enterprises overcome pain points in their HPC environments by optimizing resources and dramatically reducing data center costs,” said Charles Liang, CEO and president, Supermicro. “With the 3Leaf enabled Supermicro servers, enterprises can achieve a terabyte of DRAM at a dramatically low cost and enable low-latency messaging for fast performance.”
About SC08
SC08, sponsored by the ACM (Association for Computing Machinery) and the IEEE Computer Society Technical Committee on Scalable Computing and the IEEE Computer Society Technical Committee on Computer Architecture, will showcase how high performance computing, networking, storage and analysis lead to advances in research, education and commerce. This premiere international conference includes technical and education programs, workshops, tutorials, an exhibit area, demonstrations and hands-on learning. For more information, please visit http://sc08.supercomputing.org/.
Virtualization within high performance computing (HPC) environments presents particular challenges to today’s enterprises. HPC environments require ultra high speed message passing between applications in order to operate in high computing environments, and many of today’s virtualization solutions fall short in providing this capability. In addition, CPU and memory demands from HPC applications continue to drive over-provisioning of servers within the data center.
Now, rather than having to overbuild their infrastructures to allow for high compute or memory intensive jobs, and/or sacrificing performance to achieve virtualization, enterprises have another choice. 3Leaf’s silicon enabled technology demonstrates how enterprises can pool CPU and memory resources across multiple x86 servers to create a cloud environment, enable up to one terabyte of DRAM for memory intensive applications, and achieve low-latency messaging between applications.
“Virtualization, along with compute and memory constraints within today’s scale-out servers, provides many challenges for HPC environments,” said B.V. Jagadeesh, CEO and president, 3Leaf Systems. “With this technology, working together with companies like Supermicro, 3Leaf helps enable virtualization for HPC environments while lowering the capital and operational costs of their HPC infrastructures. Supermicro shares our vision and we are pleased the company is an early adopter of this revolutionary technology.”
“We recognize the strong, unique value that the 3Leaf technology achieves, and are excited to partner with 3Leaf to help enterprises overcome pain points in their HPC environments by optimizing resources and dramatically reducing data center costs,” said Charles Liang, CEO and president, Supermicro. “With the 3Leaf enabled Supermicro servers, enterprises can achieve a terabyte of DRAM at a dramatically low cost and enable low-latency messaging for fast performance.”
About SC08
SC08, sponsored by the ACM (Association for Computing Machinery) and the IEEE Computer Society Technical Committee on Scalable Computing and the IEEE Computer Society Technical Committee on Computer Architecture, will showcase how high performance computing, networking, storage and analysis lead to advances in research, education and commerce. This premiere international conference includes technical and education programs, workshops, tutorials, an exhibit area, demonstrations and hands-on learning. For more information, please visit http://sc08.supercomputing.org/.